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MC3423
SOIC?8
D SUFFIX
CASE 751?07
ISSUE AE
?X?
8
A
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
?Y?
B
1
4
S
0.25 (0.010)
M
Y
M
K
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751?01 THRU 751?06 ARE OBSOLETE. NEW
STANDARD IS 751?07.
G
MILLIMETERS
INCHES
?Z?
H
D
0.25 (0.010)
M
Z Y
C
S
X
SEATING
PLANE
0.10 (0.004)
S
N
X 45 _
M
J
DIM
A
B
C
D
G
H
J
K
M
N
MIN MAX
4.80 5.00
3.80 4.00
1.35 1.75
0.33 0.51
1.27 BSC
0.10 0.25
0.19 0.25
0.40 1.27
0 _ 8 _
0.25 0.50
MIN MAX
0.189 0.197
0.150 0.157
0.053 0.069
0.013 0.020
0.050 BSC
0.004 0.010
0.007 0.010
0.016 0.050
0 _ 8 _
0.010 0.020
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
4.0
0.275
0.155
0.6
1.270
0.024
0.050
mm
SCALE 6:1
inches
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
9
5.80 6.20
0.228 0.244
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